| 摘要 |
PROBLEM TO BE SOLVED: To increase an effective cooling region of a cooling device and efficiently cool a minute electronic chip to which the cooling device is attached.SOLUTION: A cooling device 50 includes a silicon substrate 22 on which a first trench 28a, a second trench 28b, and multiple channels 46 extending between the first trench 28a and the second trench 28b are defined. The silicon substrate 22 defines a first surface and a second surface which is located at substantially the opposite side of the first surface and is substantially parallel with the first surface. The multiple channels 46 extend substantially parallel with the surfaces of the silicon substrate 22. The cooling device 50 includes a minute electronic device having a heat generation region. The minute electronic device may be attached to the first surface or the second surface of the silicon substrate 22. The multiple channels 46 are formed between the first trench 28a and the second trench 28b by etching. |
