COMPOUND CARRIER BOARD STRUCTURE OF FLIP-CHIP CHIP-SCALE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. Therefore, when a die is planted in the film region of the carrier board structure, the carrier board is able to susceptible to different stresses during a package process. The baseplate uses the low Thermal Expansion Coefficient material to avoid warpage problems caused by the thermal expansion of the carrier board resulting from the thermal stresses. The carrier board is able to disperse conduction of thermal stresses by the baseplate in order to strengthen cooling effect of the compound carrier board structure. Thus, the present invention achieves miniaturization and heat strengthening and enhances the mechanical strength.

主权项

1. A compound carrier board structure of Flip-Chip Chip-Scale Package, comprising:
a carrier board having a plurality of first and second contact points, at an upper surface thereof and the second contact point located around the first contact point; and a baseplate having a plurality of electrical conductive bodies passing therethrough and a flip region with a through-opening, and the electrical conductive bodies having upper and lower ends respectively exposed at an upper surface and lower surface of the baseplate and electrically connected to lower surfaces of a plurality of first electrode pads and upper surfaces of a plurality of second electrode pads; a Non-conductive Film having an upper surface bonded to the lower surface of the baseplate; the second electrode pad having a lower surface corresponding to a position of the second contact point electronically connected to the second contact point and the first contact point corresponding to a position of the flip region located in the flip region; the Non-Conductive film having a lower surface bonded to the upper surface of the carrier board.