Verfahren und Reduzierlösung zum Metallisieren einer Oberfläche
摘要
<p>A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu2O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.</p>
申请公布号
DE19544514(C2)
申请公布日期
1997.07.10
申请号
DE1995144514
申请日期
1995.11.29
申请人
MOTOROLA, INC., SCHAUMBURG, ILL., US
发明人
MAGERA, YAROSLAW A., ALGONQUIN, ILL., US;SAVIC, JOVICA, DOWNERS GROVE, ILL., US;BROWN, VERNON L., BARRINGTON, ILL., US