发明名称 Wiring board and method for manufacturing the same
摘要 A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and having a conductor electrically connected to the conductor of the first rigid wiring board, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. The accommodation portion of the first rigid wiring board has wall surfaces tapering from a first surface of the first rigid wiring board to a second surface on the opposite side of the first surface, and the second rigid wiring board has side surfaces tapering such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board.
申请公布号 US8934262(B2) 申请公布日期 2015.01.13
申请号 US201113239707 申请日期 2011.09.22
申请人 Ibiden Co., Ltd. 发明人 Aoyama Masakazu;Noguchi Hidetoshi
分类号 H05K1/11;H05K3/46;H05K1/14;H05K1/03;H05K1/18 主分类号 H05K1/11
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A wiring board comprising: a first rigid wiring board including a first conductor and having an accommodation portion; a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and including a second conductor electrically connected to the first conductor of the first rigid wiring board; a first insulation layer formed on a top surface of the first rigid wiring board and a top surface of the second rigid wiring board; and a second insulation layer formed on a bottom surface of the first rigid wiring board and a bottom surface of the second rigid wiring board, wherein the accommodation portion of the first rigid wiring board has a plurality of wall surfaces tapering in a continuous line from the top surface of the first rigid wiring board to the bottom surface of the first rigid wiring board on an opposite side of the top surface, and the second rigid wiring board has a plurality of side surfaces tapering in a continuous line such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board.
地址 Ogaki-shi JP