| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device in which the miniaturization of the device, an increase in density, the reduction of cost and an improvement in a function are enabled and the heat-dissipating properties of the device is enhanced remarkably by augmenting the mounting area of a base body. SOLUTION: In the electronic component device 10, an electronic component element 5 housed in a cavity 7 for housing the electronic part element is arranged to the insulating base body 1 having the cavity 7 and terminal electrodes 42 in a base, while surface wiring conductor films 4 and a circuit component 6 connected to the conductor films 4 are loaded on the surface of the insulating base body 1. A die-attach conductor film 41 on which the electronic part element 5 is loaded is formed on the base of the cavity 7, while thermal via holes 8 exposed from the inwall of the cavity 7 for radiating heat by the operation of the electronic part element 5 on the base side of the base body 1 so as to be exposed from the inwall of the cavity 7 and extended in the thickness direction of the base body 1 are formed. One end section of the thermal via holes 8 is joined with the die-attach conductor film 41, and the other ends are exposed from the base of the base body 1. |
