METHOD FOR MANUFACTURING SUBSTRATE FOR ELECTRO-OPTIC DEVICE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To decrease film thickness of a first encapsulation film 72a and to increase use efficiency of light of a substrate 5 for an electro-optic device and of a liquid crystal device 100 in which the substrate 5 for an electro-optic device is mounted.SOLUTION: A method for manufacturing a substrate 5 for an electro-optic device is provided, including steps of: (step S1) forming a groove 71 on a surface 21a of a substrate body 21; (step S2) forming a sacrificial film 79 in the groove 71; (step S3) forming a first encapsulation film 72a that covers the surface 21a and the sacrificial film 79; (step S4) forming a hole 73 in the first encapsulation film 72a in a part covering the sacrificial film 79 so as to partially expose the sacrificial film 79; (step S5) removing the sacrificial film 79 through the hole 73; (step S6) subjecting the substrate to a thinning treatment to decrease the thickness of the first encapsulation film 72a; and (step S7) forming a second encapsulation film 72b that covers the first encapsulation film 72a so as to clog up the hole 73.