| 摘要 |
A chip (100) for radiation measurements, the chip comprising a first substrate (110) comprising a first sensor (111) and a second sensor (116). The chip (100) moreover comprises a second substrate (120) comprising a first cavity (121) and a second cavity (126) both with oblique walls. An internal layer (128) is present on the inside of the second cavity (126). The second substrate (120) is sealed to the first substrate with the cavities (121, 126) on the inside such that the first cavity (121) is above the first sensor (111) and the second cavity (126) is above the second sensor (116). |
