发明名称 CURING ACCELERATOR FOR EPOXY RESIN, EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a curing accelerator for epoxy resin which can prevent the flowability of an epoxy resin composition from decreasing with time, an epoxy resin composition and an electronic part device.SOLUTION: A curing accelerator for epoxy resin comprises at least one selected from the group consisting of a compound represented by general formula (I-1) and intermolecular salt thereof. (In the formula (I-1), m is an integer of 1-3, n is an integer of 1-5, Ris a 1-18C hydrocarbon group, and Rand Rare a hydrogen atom or a 1-18C organic group.)
申请公布号 JP2015000940(A) 申请公布日期 2015.01.05
申请号 JP20130126047 申请日期 2013.06.14
申请人 HITACHI CHEMICAL CO LTD 发明人 NAKAMURA SHINYA;INOUE HIDETOSHI
分类号 C08G59/62;C07F9/54;H01L23/29;H01L23/31 主分类号 C08G59/62
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