ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component and an electronic component manufacturing method, which can inhibit damages.SOLUTION: An electronic component of the present embodiment comprises: a substrate 10 which is formed by ceramics and has one or a plurality of pads 12 on an upper surface; and a semiconductor device 20 or a SAW device 22 flip-chip mounted on the upper surface of the substrate 10 by using one or a plurality of bumps which are bonded with the pads 12; and pads 14 and 16 which are provided on a lower surface of the substrate 10 and each overlaps at least a part of a smaller one between the pad 12 and the bump 24 which are bonded with each other. And provided is a manufacturing method of the electronic component.