发明名称 HEAT-TRANSFER PLATE, HEAT-TRANSFER PLATE MODULE, AND SUBMARINE APPARATUS
摘要 A heat-transfer plate includes a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with a heating component so as to transfer the heat from the heating component to the heat-transfer plate, a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate, a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion, and a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels.
申请公布号 US2014369004(A1) 申请公布日期 2014.12.18
申请号 US201414284920 申请日期 2014.05.22
申请人 FUJITSU LIMITED 发明人 Yoshizumi Takahisa;Hoshiyama Naoto
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. A heat-transfer plate that is fixed to a printed circuit board mounted with a heating component and that radiates heat from the heating component, the heat-transfer plate comprising: a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with the heating component so as to transfer the heat from the heating component to the heat-transfer plate; a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate; a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion; and a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels.
地址 Kawasaki-shi JP