发明名称 |
HEAT-TRANSFER PLATE, HEAT-TRANSFER PLATE MODULE, AND SUBMARINE APPARATUS |
摘要 |
A heat-transfer plate includes a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with a heating component so as to transfer the heat from the heating component to the heat-transfer plate, a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate, a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion, and a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels. |
申请公布号 |
US2014369004(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201414284920 |
申请日期 |
2014.05.22 |
申请人 |
FUJITSU LIMITED |
发明人 |
Yoshizumi Takahisa;Hoshiyama Naoto |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A heat-transfer plate that is fixed to a printed circuit board mounted with a heating component and that radiates heat from the heating component, the heat-transfer plate comprising:
a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with the heating component so as to transfer the heat from the heating component to the heat-transfer plate; a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate; a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion; and a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels. |
地址 |
Kawasaki-shi JP |