发明名称 GRINDING APPARATUS AND GRINDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a grinding apparatus capable of reducing the replacement frequency of a chuck table and a grinding method using the grinding apparatus.SOLUTION: A grinding apparatus include a turntable which has a turntable base 44a and is arranged so as to be rotatable along a to-be-processed object putting on and removing region and a processing region, a plurality of chuck tables 46 which are provided freely auto-rotatably on the turntable and moved in order to the processing region and have a holding surface on a suction-holding part 49 holding the object, grinding means including a grinding wheel which is located so as to face the holding surface of the chuck tables 46 arranged in the processing region, thickness detection means of detecting a thickness of the object held on the chuck tables 46 from the upper-surface height position of the chuck tables 46 located in the processing region and the upper-surface height position of the object held on the chuck table 46 located in the processing region and height position adjustment means 90 of adjusting the height position of the individual chuck tables 46.
申请公布号 JP2014237210(A) 申请公布日期 2014.12.18
申请号 JP20130122022 申请日期 2013.06.10
申请人 DISCO ABRASIVE SYST LTD 发明人 TSUNO TAKAHIKO
分类号 B24B41/06;B24B7/00;B24B47/22;B24B49/04;H01L21/304 主分类号 B24B41/06
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