| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is a material of a resist film capable of obtaining good pattern configuration, less liable to elute into an immersion liquid for liquid immersion lithography, such as water, having a large receding contact angle to the immersion liquid, and less liable to cause development defects. <P>SOLUTION: The radiation-sensitive resin composition contains: a polymer component (A) containing a first polymer having a repeating unit (a1) represented by the formula (1); and a solvent (B). (In the formula (1), R<SP POS="POST">1</SP>is a hydrogen atom, etc. R<SP POS="POST">2</SP>and R<SP POS="POST">3</SP>are independently to each other 4-20C monovalent alicyclic hydrocarbon groups, etc. Rf is an organic group, etc. which has at least one fluorine atom and a group represented by COOR<SP POS="POST">4</SP>.) <P>COPYRIGHT: (C)2012,JPO&INPIT |
