Printed circuit board assembly chip package component and soldering component

摘要

A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.

主权项

1. A printed circuit board assembly chip package component, comprising:
a module board; and an interface board; a first soldering pad arranged on a bottom surface of the module board, wherein the first soldering pad comprises a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area; a second soldering pad arranged on a top surface of the interface board; and wherein the first soldering area of the first soldering pad is positioned to register with a top surface of the second soldering pad, and when the first soldering area is soldered to the second soldering pad, the second soldering area of the first soldering pad is located outside the second soldering pad, and the second soldering area is not overlapped by the interface board.