发明名称 TRANSPORT JIG
摘要 <p>PROBLEM TO BE SOLVED: To provide a technology that secures necessary bond strength during tentative fixture of a transport jig.SOLUTION: A transport jig is tentatively fixed to a module 20 and transports the module 20. In particular, a tentative fixing surface of the transport jig 10 has a protruding structure (step parts 13 and a non-step part 14) where steps are provided at an outer periphery. More preferably, an adhesive (an adhesive layer 30) is used for tentatively fixing the transport jig 10. More preferably, the tentative fixing surface of the transport jig 10 which is tentatively fixed by using the adhesive has a rectangle shape. More preferably, steps are provided only at the shorter sides on the tentative fixing surface of the transport jig 10 having the rectangle shape. More preferably, the transport jig 10 is heated to a temperature equal to or higher than a glass transformation temperature to be peeled from the shorter sides when the transport jig 10 tentatively fixed to the module 20 is disassembled.</p>
申请公布号 JP2014223969(A) 申请公布日期 2014.12.04
申请号 JP20130103969 申请日期 2013.05.16
申请人 HITACHI LTD 发明人 SAWADA KO ; OZEKI YOSHIO ; ARAI SATOSHI
分类号 B66C1/66 主分类号 B66C1/66
代理机构 代理人
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