| 发明名称 |
MEMS Structure with Adaptable Inter-Substrate Bond |
| 摘要 |
A MEMS structure incorporating multiple joined substrates and a method for forming the MEMS structure are disclosed. An exemplary MEMS structure includes a first substrate having a bottom surface and a second substrate having a top surface substantially parallel to the bottom surface of the first substrate. The bottom surface of the first substrate is connected to the top surface of the second substrate by an anchor, such that the anchor does not extend through either the bottom surface of the first substrate or the top surface of the second substrate. The MEMS structure may include a bonding layer in contact with the bottom surface of the first substrate, and shaped to at least partially envelop the anchor. |
| 申请公布号 |
US2014353776(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414296729 |
申请日期 |
2014.06.05 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liang Kai-Chih;Lee Jiou-Kang;Lin Chung-Hsien;Lee Te-Hao;Chu Chia-Hua |
| 分类号 |
B81B3/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A MEMS device comprising:
a first substrate having a bottom surface; and a second substrate having a top surface substantially parallel to the bottom surface of the first substrate, wherein the bottom surface of the first substrate is connected to the top surface of the second substrate by an anchor, and wherein the anchor does not extend through either the bottom surface of the first substrate or the top surface of the second substrate. |
| 地址 |
Hsin-Chu TW |
