WIRING BOARD

摘要

A wiring board according to the present invention includes an insulating layer 3, a semiconductor element mounting portion 1a, semiconductor element connection pads 11, via holes 8, and via conductors 10. The semiconductor element connection pads 11 aligned on the semiconductor element mounting portion 1a include first semiconductor element connection pads 11a and other second semiconductor element connection pads 11b, and the diameters of the via conductors 10 connected to the first semiconductor element connection pads 11a are larger than the diameters of the via conductors 10 connected to the second semiconductor element connection pads 11b.

主权项

1. A wiring board comprising:
an insulating layer having lower-layer conductors on a lower surface of the insulating layer; a semiconductor element mounting portion formed on the insulating layer; a plurality of semiconductor element connection pads arranged in a lattice pattern on the semiconductor element mounting portion; via holes formed in the insulating layer under the semiconductor element connection pads with the lower-layer conductors as bottom surfaces; and via conductors formed integrally with the semiconductor element connection pads and formed in the via holes to be electrically connected to the lower-layer conductor, wherein the semiconductor element connection pads include first semiconductor element connection pads formed at outer peripheral corner portions of the semiconductor element mounting portion and other second semiconductor element connection pads, and diameters of the via conductors connected to the first semiconductor element connection pads are larger than diameters of via conductors connected to the second semiconductor element connection pads.