APPARATUS FOR ADVANCED PACKAGING APPLICATIONS

摘要

The embodiments disclosed herein pertain to novel methods and apparatus for removing material from a substrate. In certain embodiments, the method and apparatus are used to remove negative photoresist, though the disclosed techniques may be implemented to remove a variety of materials. In practicing the disclosed embodiments, a stripping solution may be introduced from an inlet to an internal manifold, sometimes referred to as a cross flow manifold. The solution flows laterally through a relatively narrow cavity between the substrate and the base plate. Fluid exits the narrow cavity at an outlet, which is positioned on the other side of the substrate, opposite the inlet and internal manifold. The substrate spins while in contact with the stripping solution to achieve a more uniform flow over the face of the substrate. In some embodiments, the base plate includes protuberances which operate to increase the flow rate (and thereby increase the local Re) near the face of the substrate.

主权项

1. A method of removing material from a substrate, comprising:
(a) receiving a substrate having material for removal thereon; (b) positioning and sealing the substrate in a substrate holder such that the material for removal is exposed; (c) positioning the substrate holder in a removal position, thereby forming a gap defined on one side by the substrate, defined on the opposite side by a base plate, and defined around the edges by a flow distributor,
wherein the gap has a dimension between about 2-10 mm as measured in a direction perpendicular to a face of the substratewherein the flow distributor comprises:
(i) an internal manifold spanning between about 90-180° around the flow distributor, wherein the internal manifold is a cavity in the flow distributor through which fluid may flow,(ii) one or more inlets for delivering fluid from one or more fluid supply lines to the internal manifold, and(iii) an outlet manifold spanning between about 90-180° around the flow distributor, and positioned opposite the internal manifold; (d) rotating the substrate in the substrate holder; and (e) flowing stripping solution from the one or more inlets, through the internal manifold, into the gap and over the face of the substrate, and out through the outlet manifold, to thereby remove from the substrate at least some of the material for removal.