SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a peeled layer is attached to a base material having a curved surface and a manufacturing method of the semiconductor device; especially provide a display having a curved surface, and in particular, provide an organic light-emitting element attached to a base material having a curved surface.SOLUTION: A semiconductor device manufacturing method comprises: transferring to a film, a peeled layer including an organic light-emitting element provided on a substrate by utilizing lamination of a first material layer composed of a metal layer or a nitride layer and a second material layer composed of an oxide layer; and causing curvature in the film and the peeled layer to achieve a display having a curved surface.