发明名称 レーザ切断加工方法及び装置
摘要 PROBLEM TO BE SOLVED: To provide a laser cutting method and a laser cutting apparatus which perform laser cutting on a planar workpiece. SOLUTION: In the laser cutting method and the laser cutting apparatus, prior to laser cutting of a planar workpiece W, a plurality of times of piercing are performed in which the approaching positions of a condenser lens 5 to the workpiece are variously changed and the focal positions to the workpiece are variously changed, and a focal position is held and the workpiece is subjected to laser cutting, the focal position giving the minimum value to the detected value of the quantity of scattered light detected upon the piercing for a plurality of times. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5631138(B2) 申请公布日期 2014.11.26
申请号 JP20100221179 申请日期 2010.09.30
申请人 发明人
分类号 B23K26/38;B23K26/00;B23K26/046;B23K26/382 主分类号 B23K26/38
代理机构 代理人
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