发明名称 Nitride semiconductor diode
摘要 Disclosed is a high performance nitride semiconductor having a reverse leak current characteristic with two-dimensional electron gas as a conductive layer. A desired impurity is diffused into or a nitride semiconductor to which a desired impurity is added is re-grown on the bottom surface and the side face portion of a recessed portion formed by dry etching using chlorine gas on the upper surface of a nitride semiconductor stacked film to increase resistance of the side face portion of the nitride semiconductor stacked film contacting an anode electrode, reducing the reverse leak current.
申请公布号 US8896027(B2) 申请公布日期 2014.11.25
申请号 US201213684508 申请日期 2012.11.24
申请人 Hitachi, Ltd. 发明人 Terano Akihisa;Mochizuki Kazuhiro;Tsuchiya Tomonobu
分类号 H01L29/66;H01L29/205;H01L29/872;H01L29/16;H01L29/207;H01L29/06;H01L29/20;H01L29/47 主分类号 H01L29/66
代理机构 Miles & Stockbridge P.C. 代理人 Miles & Stockbridge P.C.
主权项 1. A nitride semiconductor diode comprising: a substrate; a heterojunction stacked film on which a first nitride semiconductor layer formed on the substrate and a second nitride semiconductor layer greater in band gap energy than the first nitride semiconductor layer are stacked; a cathode electrode ohmically connected with the side face of the stacked film; and an anode electrode, wherein the stacked film is provided with a recessed portion which reaches the depth of a heterojunction surface being the interface of the first and second nitride semiconductor layers, wherein the recessed portion is provided with a region where at least one type of impurity selected from among a group of carbon (C), iron (Fe), zinc (Zn), and magnesium (Mg) is implanted, and wherein the anode electrode contacts the region and is schottky connected with the stacked film.
地址 Tokyo JP