TEMPORARY ADHERING MATERIAL FOR WAFER, FILM FOR TEMPORARY ADHERING AND WAFER PROCESSING LAMINATE USING THE SAME, AND MANUFACTURING METHOD OF THIN WAFER USING THE SAME

摘要

Provided in the present invention is a temporary adhering material which is characterized by including a first temporary adhering layer including a silicone containing polymer layer (A) containing a photo base generating agent; and a second temporary adhering layer including a silicone containing polymer layer (B) which is different from the polymer layer (A) and not containing the photo base generating agent laminated on the first temporary adhering layer. The temporary adhering layers of the present invention can form a temporary adhering layer having high uniformity of film thickness even for a wafer having bumps and can easily obtain a uniform thin wafer of 50 micrometers or less by the uniformity of film thickness. In addition, the wafer is separated in stress-free by the small amount of exposure, when separated from a support, in order to manufacture the thin wafer by easily treating the thin wafer without damage to the thin wafer which can be easily cracked.