| 摘要 |
<p>The present invention relates to a method for packaging an inertial sensor. The method for packaging the inertial sensor according to the present invention includes the steps of: spraying a dry film on an arrangement pad formed on the upper side of an IC; printing solder paste on the upper side of the dry film; arranging the inertial sensor on the upper side of the solder paste; performing a reflow operation to combine the IC with the inertial sensor; removing the dry film; and bonding a package carrier to the lower side of the IC. Thereby, costs and manufacturing time are reduced by performing an automatic arrangement to conform the coordinate system of the inertial sensor to the coordinate system of the carrier by a simple configuration.</p> |
