| 摘要 |
<p>The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connected together, or in a semiconductor device in which the connection parts of a plurality of semiconductor chips are electrically connected together, wherein the adhesive composition contains an epoxy resin, a curing agent, and a vinyl-based surface treatment filler.</p> |
