| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device capable of securing earthquake resistance and being downsized.SOLUTION: A power conversion device 1 comprises: semiconductor modules 2A1, 2A2, and 2B including semiconductor elements 21A and 21B; a cooler 4 which comes into contact with and cools the semiconductor modules 2A1, 2A2, and 2B; a control circuit unit 3 including a control substrate 31 which controls the operation of the semiconductor elements 21A and 21B and arranged in contact with the cooler 4; and pressurizing means 5 for pressurizing a state in which the semiconductor modules 2A1, 2A2, and 2B, the cooler 4, and the control circuit unit 3 are laminated in a lamination direction L. |
