| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting component that has a large manufacturing margin and suppresses the occurrence of failure in transferring transfer thyristors.SOLUTION: A light emitting chip U includes: a plurality of light emitting thyristors L that are composed of a semiconductor laminate having a p-type first semiconductor layer 81, n-type second semiconductor layer 82, p-type third semiconductor layer 83, and n-type fourth semiconductor layer 84 laminated in order, and emit light in an on state; a plurality of transfer thyristors T that shift to the on state in order so that the on state is transferred and set the corresponding thyristors L to be capable of emitting light; and a plurality of coupling transistors C that are composed of the first semiconductor layer 81, second semiconductor layer 82, and third semiconductor layer 83 and couple the adjacent transfer thyristors T in the former stage and latter stage, where the first semiconductor layer 81 continues to the second semiconductor layer 82 between the transfer thyristors T in the former stage, and the third semiconductor layer 83 continues in a thickness at which the third semiconductor layer 83 is depleted while no voltage is applied thereto. |
