| 摘要 |
PROBLEM TO BE SOLVED: To mount an electronic component on a circuit board at a good angle.SOLUTION: In a method of mounting an optical element, solders 304, 305, 306 are applied on electrode lands 307, 308, 309 of a circuit board 300 through opening parts 310, 311, 313 of a metal mask, and an electrode of an optical element is mounted on the applied solders 304, 305, 306 and then the solders 304, 305, 306 are melted so that the optical element is mounted on the circuit board 300. The electrode land corresponding to one electrode of the optical element is divided into a plurality of pieces. By allowing areas of the plurality of opening parts 310, 311 of the metal mask corresponding to the plurality of electrode lands 307, 308, 309 to be different from each other, the amount of the applied solders 304, 305, 306 is adjusted, thus the optical element is mounted on the circuit board 300 in inclined state. |
