| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent cracks from being generated in a build-up layer.SOLUTION: A land 61 is formed into a plate shape, therefore a solder wettability of at least part of a surface 61a opposite to a build-up layer side 30 is raised than that of a side surface 61c. Electronic parts 121 to 123 are mounted on the surface 61c of the land 61 via a solder 130. When electronic equipment in which the land 61 and electronic parts 121 to 123 are sealed with a mold resin 150, is configured, it is possible to prevent the solder 130 from wetting and spreading on the side surface 61c of the land 61. The mold resin 150 is arranged on the side surface 61c of the land 61 so as to adhere tightly to the side surface 61c. Therefore it is possible to prevent cracks from being generated in the build-up layer 30.</p> |
