| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic device capable of enhancing heat dissipation of a heater element by suppressing deformation of the bump of a heater element, and to provide a method of manufacturing an electronic device.SOLUTION: A module substrate 30 mounting a semiconductor element 31 via a bump 32 is prepared, and a mother board 20 having each heat dissipation via 22 and through hole 24 formed therein is prepared. The module substrate 30 is joined to a mother board 20 by soldering so that the semiconductor element 31 faces each heat dissipation via 22 via a predetermined gap S. An underfill 34 is applied to a bump bonding region 33 via the through hole 24, and a bonding material 23 for heat dissipation is applied to the predetermined gap S.</p> |
