发明名称 METHOD FOR RECOVERING COPPER FROM Sn PLATING STRIPPING WASTE LIQUID
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for efficiently recovering copper from stripping waste liquid of Sn plating formed on the surface of copper or copper-based alloy by electrowinning in a reusable state.SOLUTION: There is provided a method for efficiently recovering copper from Sn plating stripping waste liquid formed on the surface of a copper or copper-based alloy plate. Plating stripping solution has sulfuric acid concentration at 5 to 300 g/L, and Sn plating stripping waste liquid has SnO or SnOconcentration at 1 to 100 g/L and Cu concentration at 30 to 60 g/L. At least one additive selected from the group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate is added to the Sn plating stripping waste liquid by 0.01 to 10 g/L, and furthermore, at least one surfactant selected from the group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate is added to the waste liquid by 0.001 to 10 g/L to adjust surface tension to 50 dyn/cm or less, and then, copper is precipitated by electrolysis and recovered.</p>
申请公布号 JP2014214378(A) 申请公布日期 2014.11.17
申请号 JP20130095792 申请日期 2013.04.30
申请人 MITSUBISHI MATERIALS CORP;MITSUBISHI SHINDOH CO LTD 发明人 KATO NAOKI;KUBOTA KENJI;TARUTANI YOSHIE;KUMAGAI JUNICHI
分类号 C25C1/12;C23F1/00;C23F1/46;C25D5/50 主分类号 C25C1/12
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