发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 A semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device uses an aluminum alloy, rather than aluminum, for a metal gate. Therefore, the surface of the high-k metal gate after the CMP is aluminum alloy rather than pure aluminum, which can greatly reduce defects, such as corrosion, pits and damage, in the metal gate and improve reliability of the semiconductor device.
申请公布号 US2014332907(A1) 申请公布日期 2014.11.13
申请号 US201414337683 申请日期 2014.07.22
申请人 SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION 发明人 JIANG Li;LI Mingqi;ZHU Pulei
分类号 H01L29/49 主分类号 H01L29/49
代理机构 代理人
主权项 1. A semiconductor device, comprising: a semiconductor substrate; a gate insulating layer over the substrate, the gate insulating layer having a dielectric constant greater than 10; a first barrier layer on the gate insulating layer; and an aluminum alloy gate on the first barrier layer.
地址 SHANGHAI CN