| 摘要 |
<p>Disclosed are a wafer packing system and a taping unit applied thereto which can prevent an error in labeling and enhance productivity. Such a wafer packing system includes a wafer information checking unit, a loading unit, a packing unit, a taping unit, a conveying unit, and a controlling unit. The wafer information checking unit opens a cover of a FOUP loaded on a load port to check an aligned state of wafers and wafer information. The loading unit includes a wafer box loading module for loading empty wafer boxes, a wafer box cover loading module for loading wafer box covers, and an interleaf loading module for loading interleaves. The packing unit packs the interleaves of the interleaf loading module and the empty wafer boxes in turns. The taping unit arranges the wafer box cover at the top of the wafer box in which the interleaves and the wafers are packed and stored in turns and tapes the boundary part between the wafer box and the wafer box cover. The conveying unit conveys the wafers, the interleaves, the wafer boxes and the wafer box covers. The controlling unit controls the wafer information checking unit, the loading unit, the packing unit, the taping unit, and the conveying unit.</p> |
