| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer chamfering method for preventing a periphery of a wafer from being chipped. <P>SOLUTION: The chamfering method for chamfering a wafer W while holding only an under surface WA in a discoid wafer W includes: a coarse-grinding process for using an abrasive material for coarse grinding to grind a periphery WC of a top surface WB being the other surface of the wafer W and a lateral surface WD of the wafer W; and a fine-grinding process to be performed after the coarse-grinding process, comprising a non-holding surface fine-grinding stage for grinding, using an abrasive material for fine grinding, a periphery WC1 of the top surface WB of a wafer W1 and a lateral surface WD1 of the wafer W1, and a holding surface fine-grinding stage for grinding, using the abrasive material for fine grinding, at least a periphery WE1 from among the periphery WE1 of the under surface WA of the wafer W1 and the lateral surface WD1 of the wafer W1. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
