| 发明名称 | Abrasive slicing tool for electronics industry | ||
| 摘要 | A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations. | ||
| 申请公布号 | US8882868(B2) | 申请公布日期 | 2014.11.11 |
| 申请号 | US200912494602 | 申请日期 | 2009.06.30 |
| 申请人 | Saint-Gobain Abrasives, Inc.;Saint-Gobain Abrasifs | 发明人 | Walia Parul;Ramanath Srinivasan;Hall Richard W. |
| 分类号 | B24B1/00;B24D3/00;B24D5/12;B24D3/06 | 主分类号 | B24B1/00 |
| 代理机构 | Abel Law Group, LLP | 代理人 | Sullivan Joseph P.;Abel Law Group, LLP |
| 主权项 | 1. A metal bonded abrasive tool comprising: a. abrasive grains; b. a metal bond composition including from about 10 to about 70 weight percent nickel, from about 5 to about 40 weight percent tin and a continuous phase of from about 0.01 to about 40 weight percent pre-alloyed bronze; and c. less than about 20 volume % total porosity. | ||
| 地址 | Worcester MA US | ||