TEMPERATURE ASSISTED PROCESSING OF FLEXIBLE GLASS SUBSTRATES

摘要

A method of processing a flexible glass substrate includes providing a substrate stack comprising the flexible glass substrate bonded to a carrier substrate. A perimeter portion of the flexible glass substrate is heated to a temperature greater than that of a device portion of the flexible glass substrate using a heating fixture that transmits heat to the perimeter portion thereby creating a thermal gradient between the perimeter portion and the device portion and introducing tensile forces within the perimeter portion. The tensile forces separate the device portion of the flexible glass substrate from the perimeter portion along a score line.