发明名称 Electronic device substrate, method for manufacturing substrate
摘要 <p>An electronic device substrate includes a substrate having at least one of a metal and a metal oxide on a surface thereof and an underlying layer having a compound expressed by a following general formula (1): wherein X presents one of a hydrogen atom and a protecting group; Y 1 represents one of an oxygen atom, an alkylene group and -N(R 1 )-, in which R 1 represents an alkyl group. Z 1 represents a polymerization initiating group; n 1 represents an integer from 1 to 4; and m 1 represents an integer from 1 to 15.</p>
申请公布号 EP1854553(B1) 申请公布日期 2014.11.05
申请号 EP20070251888 申请日期 2007.05.04
申请人 SEIKO EPSON CORPORATION 发明人 FUKUSHIMA, HITOSHI;YOKOKAWA, SHINOBU
分类号 B05D7/02;B82Y10/00;C08F290/14;C08F291/00;C08F292/00;C08F293/00;C08J7/18;H01L51/00;H01L51/05 主分类号 B05D7/02
代理机构 代理人
主权项
地址