发明名称 |
Methods for forming resistive switching memory elements by heating deposited layers |
摘要 |
Resistive switching nonvolatile memory elements are provided. A metal-containing layer and an oxide layer for a memory element can be heated using rapid thermal annealing techniques. During heating, the oxide layer may decompose and react with the metal-containing layer. Oxygen from the decomposing oxide layer may form a metal oxide with metal from the metal-containing layer. The resulting metal oxide may exhibit resistive switching for the resistive switching memory elements. |
申请公布号 |
US8877550(B2) |
申请公布日期 |
2014.11.04 |
申请号 |
US201213371220 |
申请日期 |
2012.02.10 |
申请人 |
Intermolecular, Inc. |
发明人 |
Kumar Pragati;Barstow Sean;Shanker Sunil;Chiang Tony |
分类号 |
H01L45/00;H01L27/04;H01L27/24 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating a resistive switching memory element, comprising:
forming a first layer that contains a first metal; forming a second layer that contains a second metal and oxygen; forming a resistive switching layer by heating the first and second layers so that the oxygen from the second layer oxidizes the first metal; and forming a metal layer from the second metal, wherein forming the metal layer comprises forming a second electrode. |
地址 |
San Jose CA US |