发明名称 Methods for forming resistive switching memory elements by heating deposited layers
摘要 Resistive switching nonvolatile memory elements are provided. A metal-containing layer and an oxide layer for a memory element can be heated using rapid thermal annealing techniques. During heating, the oxide layer may decompose and react with the metal-containing layer. Oxygen from the decomposing oxide layer may form a metal oxide with metal from the metal-containing layer. The resulting metal oxide may exhibit resistive switching for the resistive switching memory elements.
申请公布号 US8877550(B2) 申请公布日期 2014.11.04
申请号 US201213371220 申请日期 2012.02.10
申请人 Intermolecular, Inc. 发明人 Kumar Pragati;Barstow Sean;Shanker Sunil;Chiang Tony
分类号 H01L45/00;H01L27/04;H01L27/24 主分类号 H01L45/00
代理机构 代理人
主权项 1. A method for fabricating a resistive switching memory element, comprising: forming a first layer that contains a first metal; forming a second layer that contains a second metal and oxygen; forming a resistive switching layer by heating the first and second layers so that the oxygen from the second layer oxidizes the first metal; and forming a metal layer from the second metal, wherein forming the metal layer comprises forming a second electrode.
地址 San Jose CA US