Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

摘要

A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

主权项

1. A substrate for supporting and electrically connecting to a semiconductor dice, the substrate including a first surface and a second surface opposite the first surface, the second surface including a second pattern, the substrate comprising:
a first pattern on the first surface of the substrate, the first pattern formed in a copper layer of the substrate and comprising: an etched portion; and an unetched portion surrounding the etched portion and directly above the second pattern, the first pattern reducing a mechanical stress generated by the second pattern on the semiconductor dice during a molding process.