| 摘要 |
PROBLEM TO BE SOLVED: To improve mountability of an electronic component on a multilayer wiring board formed by press/calcination.SOLUTION: A multilayer wiring board 2 is formed by laminating a plurality of insulation layers and comprises: a laminate 5 on which an electronic component 3a is mounted; a plurality of connection terminals 4 provided on one principal surface 5a of the laminate 5 for connecting with the electronic component 3a; and a plurality of rear electrodes 6a-6c provided on another principal surface 5b of the laminate 5. Each of the connection terminals 4 is disposed so as to be overlapped with any one of the rear electrodes 6a-6c in a planar view. |
