发明名称 PRINTED-CIRCUIT-BOARD MATERIAL AND PRINTED CIRCUIT BOARD USING SAME
摘要 <p>This invention provides the following: a printed-circuit-board material wherein the top surface of a copper or other metal film is resistant to smearing, and even if smearing does occur, said smearing is easy to remove; and a printed circuit board using said printed-circuit-board material. Said printed-circuit-board material contains the following: a binder component; cellulose nanofibers having a number-average diameter between 3 and 1,000 nm, inclusive; and an acrylic-copolymer compound. Said printed-circuit-board material is suitable for use as a solder resist or as an interlayer insulation material for multilayer printed circuit boards. This printed circuit board uses said printed-circuit-board material.</p>
申请公布号 WO2014175244(A1) 申请公布日期 2014.10.30
申请号 WO2014JP61235 申请日期 2014.04.22
申请人 TAIYO HOLDINGS CO., LTD. 发明人 KAKUTANI TAKENORI;SHIBATA DAISUKE;USHIKI SHIGERU;ENDO ARATA;MIWA TAKAO
分类号 H05K1/03;C08L33/00;C08L97/02;C08L101/00;H05K3/28;H05K3/46 主分类号 H05K1/03
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