| 发明名称 |
ROLLED COPPER FOIL WITH COPPER PLATING LAYER |
| 摘要 |
<p>The present invention relates to a rolled copper foil with a copper plating layer. More particularly, the present invention relates to a rolled copper foil with a copper plating layer to obtain excellent bending resistance. A rolled copper foil with a copper plating layer according to one embodiment of the present invention includes crystal faces. According to one embodiment of the present invention, rolled copper foil with a copper plating layer includes a touch pitch. According to one embodiment of the present invention, a rolled copper foil with a copper plating layer is for a flexible printed circuit.</p> |
| 申请公布号 |
KR20140125720(A) |
申请公布日期 |
2014.10.29 |
| 申请号 |
KR20140039123 |
申请日期 |
2014.04.02 |
| 申请人 |
SH COPPER PRODUCTS CO., LTD. |
发明人 |
MUROGA TAKEMI;GOTO CHIZURU |
| 分类号 |
C25D7/06;B21B1/40;C25D5/10 |
主分类号 |
C25D7/06 |
| 代理机构 |
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