| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a highly reliable electronic device which ensures high microfabrication accuracy of an insulating layer, becoming a rewiring formation layer, by ensuring planarity of a sealing resin layer covering an electronic component, while suppressing increase in the fabrication process and fabrication cost as much as possible.SOLUTION: A support 3 is fixed to the back side of an insulating layer 1 in contact therewith, and a plurality of electronic components 2 are fixed to the front side of the insulating layer 1 while facing the electrode formation surfaces thereof. A sealing resin layer 5 is formed on the insulating layer 1 so as to cover the electronic components 2, and then the support 3 is peeled off from the insulating layer 1 by heating treatment, before microfabricating the insulating layer 1. |
