发明名称 |
SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE AND METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a suspension substrate on which an end part of a second wiring layer directly laminated on a first wiring layer is stably protected by a cover layer.SOLUTION: In the suspension substrate comprising: a metallic support substrate; a first insulating layer formed on the metallic support substrate; a first wiring layer formed on the first insulating layer; a second insulating layer formed on the first wiring layer; a second wiring layer formed on the second insulating layer; and a cover layer formed on the second wiring layer, the first insulating layer, the first wiring layer and the second wiring layer are laminated in this order and a stepped portion covered with the cover layer is formed. The stepped portion has a stable protection stepped portion in which the total thickness of the first wiring layer and the second wiring layer is 16.4 μm or less. |
申请公布号 |
JP2014203504(A) |
申请公布日期 |
2014.10.27 |
申请号 |
JP20130081874 |
申请日期 |
2013.04.10 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ONUKI MASAO;YAMAZAKI TAKESHI |
分类号 |
G11B5/60;G11B21/21 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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