发明名称 SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE AND METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a suspension substrate on which an end part of a second wiring layer directly laminated on a first wiring layer is stably protected by a cover layer.SOLUTION: In the suspension substrate comprising: a metallic support substrate; a first insulating layer formed on the metallic support substrate; a first wiring layer formed on the first insulating layer; a second insulating layer formed on the first wiring layer; a second wiring layer formed on the second insulating layer; and a cover layer formed on the second wiring layer, the first insulating layer, the first wiring layer and the second wiring layer are laminated in this order and a stepped portion covered with the cover layer is formed. The stepped portion has a stable protection stepped portion in which the total thickness of the first wiring layer and the second wiring layer is 16.4 μm or less.
申请公布号 JP2014203504(A) 申请公布日期 2014.10.27
申请号 JP20130081874 申请日期 2013.04.10
申请人 DAINIPPON PRINTING CO LTD 发明人 ONUKI MASAO;YAMAZAKI TAKESHI
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
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