| 摘要 |
A high-frequency module includes a wiring substrate including an electrode pattern layer and a via electrode, a plurality of amplifier circuits that are configured to respectively amplify signals in different frequency bands received at the input terminal, and a plurality of matching circuits and a plurality of filter circuits that are provided in correspondence with the respective amplifier circuits and that are connected sequentially to output sides of the respective amplifier circuits. A plurality of signal paths that extend from the output sides of the respective amplifier circuits to the antenna terminal through the corresponding matching circuits and the filter circuits are provided. The electrode pattern layer and the via electrode are grounded and at least one of the electrode pattern layer and the via electrode is arranged between the signal paths. |
