发明名称 HEAT-DISSIPATING STRUCTURE FOR LIGHTING APPARATUS AND LIGHTING APPARATUS
摘要 There is provided a lighting device including: a light emitting module having at least one light emitting device outputting light and a light emitting device board on which the at least one light emitting device is disposed; a housing installed on one side of a ring in a central axis direction relatively to the light emitting device board; and a resin globe installed to cover the light emitting module, wherein the globe has a plurality of protrusions formed by retaining at least a portion of a gate unit used in molding the globe, and the light emitting device board may have notch portions combined with the protrusions.
申请公布号 EP2792944(A1) 申请公布日期 2014.10.22
申请号 EP20120858384 申请日期 2012.12.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 TAKENAKA, HIROMITSU;MORISHITA, ICHIRO
分类号 F21V29/00;F21V17/00 主分类号 F21V29/00
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