| 摘要 |
The present invention relates to an ultrasound selective soldering device and, more specifically, to a device capable of soldering a printed circuit board (PCB) or the like which cannot be soldered with the existing soldering device, through a cavitation phenomenon generated by directly applying ultrasound vibration to overflowing molten lead after mounting an ultrasound device in a selective soldering device. An ultrasound selective soldering device according to an embodiment of the present invention comprises a selective soldering device locally implementing wave soldering by overflowing molten lead to an upper part of a nozzle, and an ultrasound device installed in the selective soldering device and applying vibration to the overflowing molten lead. |
