发明名称 CONDUCTIVE PATTERN FORMATION METHOD
摘要 Provided is a conductive pattern formation method capable of improving conductivity of a conductive pattern. An ink layer 12 is formed by printing a composition (ink) containing metal oxide particles and a reducing agent, and/or metal particles, on a surface of a substrate 10 and the ink layer 12 is heated by photo irradiation or microwave irradiation so that conductivity is expressed on the heated portion and the ink layer 12 is converted into a conductive layer 14. Metal particles and/or metal oxide particles are heated quickly in a short time and air bubbles are generated during photo irradiation or microwave irradiation and voids are generated inside the conductive layer 14, and thus the conductive layer 14 is pressurized by an appropriate pressing machine 16 to crush the voids to improve conductivity of the conductive layer 14 before obtaining a conductive pattern 18. When the conductive layer 14 is pressurized, an insulating protection film 20 can simultaneously be pressure-sealed on the surface of the substrate on which the conductive layer 14 is formed.
申请公布号 US2014308460(A1) 申请公布日期 2014.10.16
申请号 US201214359598 申请日期 2012.11.26
申请人 SHOWA DENKO K.K. 发明人 Uchida Hiroshi
分类号 H05K3/10 主分类号 H05K3/10
代理机构 代理人
主权项 1. A conductive pattern formation method comprising: printing a composition containing metal oxide particles and a reducing agent, and/or metal particles, on a surface of a substrate; heating at least a part of the printed composition by an internal heat generation system so that conductivity is expressed on the heated portion; and pressurizing the portion expressing the conductivity to obtain a conductive pattern.
地址 Minato-ku, Tokyo JP