| 摘要 |
<p>A device with one or more of a micro- or nanoscale mechanical structure, a micro- or nanoscale sensing element, or an active and/or passive micro- or nanoscale electrical circuitry, integrated at a front side (12) of a substrate (1). The device comprises a support (2) arranged at a back side (13) of the substrate (1) for mounting the device to a carrier (4), wherein the support (2) comprises a first member (21) comprising contact pads (25) for electrically connecting the device to the carrier (4), and a second member (22) in between the first member (21) and the substrate (1). One or more vias (17) extend through the substrate (1) between the front side (12) and the back side (13) of the substrate (1). The second member (25) has a cross section area (A2) smaller than a cross section area of the substrate (1) and smaller than a cross section area (A1) of the first member (21).</p> |
