ULTRASONIC BONDING APPARATUS FOR CAMERA MODULE

摘要

An ultrasonic bonding apparatus for a camera module according to the embodiment of the present invention includes a stage, a receiving groove part which is formed on the stage and into which a junction object is inserted, a hot press which is arranged on the upper side of the stage to be lifted, and an ultrasonic excitation device which is separately arranged on the side of the stage with a preset distance and excites an ultrasonic wave on the stage.