Semiconductor device, method for manufacturing semiconductor device, method for laminating semiconductor wafers, and electronic device

摘要

A method for manufacturing a semiconductor device including: forming a wiring layer on a surface side of a first semiconductor wafer; forming a buried film so as to fill in a level difference on the wiring layer, the level difference being formed at a boundary between a peripheral region of the first semiconductor wafer and an inside region being on an inside of the peripheral region, and the level difference being formed as a result of a surface over the wiring layer in the peripheral region being formed lower than a surface over the wiring layer in the inside region, and making the surfaces over the wiring layer in the peripheral region and the inside region substantially flush with each other; and opposing and laminating the surfaces over the wiring layer formed in the first semiconductor wafer to a desired surface of a second semiconductor wafer.

主权项

1. A method for manufacturing a semiconductor device, the method comprising:
forming a wiring layer on a surface side of a first semiconductor wafer; forming a buried film so as to fill in a level difference on said wiring layer, the level difference being formed at a boundary between a peripheral region of said first semiconductor wafer and an inside region of said first semiconductor wafer, the inside region being on an inside of the peripheral region, and the level difference being formed as a result of a surface over the wiring layer in said peripheral region being formed lower than a surface over the wiring layer in said inside region, and making the surfaces over the wiring layer in the peripheral region and the inside region substantially flush with each other, before forming the wiring layer on the surface side of said first semiconductor wafer, forming a pixel region in said first semiconductor wafer, the pixel region including a photoelectric conversion section for generating a signal charge corresponding to an amount of light received and a reading section for reading the signal charge generated in the photoelectric conversion section; and opposing and laminating the surfaces over the wiring layer formed in said first semiconductor wafer to a desired surface of a second semiconductor wafer, wherein a backside illumination type solid-state imaging device is manufactured.