发明名称 Packing buffer and manufacturing method thereof
摘要 Disclosed are a packing buffer having enhanced manufacture efficiency, high strength, and eco-friendly properties and a manufacturing method thereof. The packing buffer includes reinforcement sheet provided at the exterior of the packing buffer for increase in strength of the packing buffer. Injection molding of the packing buffer is implemented in a state in which the reinforcement sheet is inserted in a mold.
申请公布号 EP2786943(A1) 申请公布日期 2014.10.08
申请号 EP20140159268 申请日期 2014.03.12
申请人 SAMSUNG ELECTRONICS CO., LTD.;M KOREA CO., LTD. 发明人 MOON, EUN HO;KIM, SUK HWAN;LEE, DONG HUN;JEONG, HEON KWON
分类号 B65D81/113;B29C44/12 主分类号 B65D81/113
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